Description
The Computer Thermal Model couples a computer’s electrical power consumption to the spacecraft thermal network. It converts electrical power draw into heat generation, allowing the thermal system to model heat rejection from computing hardware. The model also provides optional overtemperature protection that can automatically transition the computer to safe mode or initiate shutdown when temperature limits are exceeded.
Example Use Cases
- Thermal Analysis: Model heat dissipation from onboard computers during mission phases with varying computational loads.
- Fault Protection: Simulate autonomous thermal safing behavior when computers exceed operational temperature limits.
- Power-Thermal Coupling: Analyze the relationship between computer power states and thermal environment.
Module Implementation
Heat Dissipation
The thermal model sources its electrical power from the parent computer’s power model. When a power bus solution is available, the model uses the actual absorbed power from the circuit solve. Otherwise, it falls back to the state-based power consumption estimate.
The heat dissipated into the thermal node is computed as:
where is the electrical power consumption and is the dissipation fraction. For typical computing hardware, nearly all electrical power is converted to heat, so .
Overtemperature Protection
When thermal protection is enabled, the model monitors the node temperature against configurable thresholds. The overtemperature flag is set using hysteresis to prevent rapid state cycling:
where is the overtemperature threshold (default 358.15 K / 85°C) and is the hysteresis band (default 10 K).
When the overtemperature condition is active and thermal protection is enabled:
- If , the computer is commanded to shut down.
- Otherwise, the computer is commanded to enter safe mode.
The shutdown threshold defaults to 373.15 K (100°C).
Default Thermal Properties
The model initializes with properties typical of electronics assemblies:
| Property | Default Value | Description |
|---|---|---|
| Specific Heat Capacity | 900 J/(kg·K) | Aluminum/PCB composite |
| Emissivity | 0.85 | Typical electronics coating |
| Surface Area | 0.05 m² | Internal bay mounting |
| Space Radiation | Disabled | Assumes internal mounting |
Assumptions/Limitations
- The model assumes all dissipated electrical power is deposited into a single thermal node.
- Thermal protection actions (safe mode, shutdown) require the parent computer to support these state transitions.
- The dissipation fraction is constant and does not vary with temperature or operating mode.
- Internal component-level thermal gradients within the computer are not modeled.
- Thermal protection is disabled by default to maintain compatibility with existing simulations.